Typical Duty Conditions
The following describes the duty conditions each product is built for. It is selection guidance, not a list of specific customer cases.
- Wafer slicing: carbon-steel diamond wire from 26 to 550 µm for multi-wire slicing; thinner wafers and larger ingots move to 24–30 µm tungsten-core wire to cut kerf loss and raise wafer yield per ingot.
- Squaring and cropping: loop diamond wire runs as a closed loop at high speed — flat kerf, no joint, suited to squaring and cropping silicon ingots.
- Crystal growth: tungsten wire rope for the pulling system of single-crystal furnaces, where high strength, low elongation, heat resistance and fatigue resistance all matter.
- Quartz crucibles: high-purity quartz sand feeds crucible production; trace elements and particle-size distribution drive crucible life and wafer yield.
- Fuel cells and flow batteries: graphite composite bipolar plates combine conductivity, corrosion resistance and gas tightness.
- Hard and brittle materials: sapphire, magnetic materials and precious stone slicing and shaping.
- Humanoid robotics: ultra-fine tungsten wire down to 0.005 mm as the base material for bio-inspired tendon rope in humanoid and surgical robots.
For a selection recommendation, tell us the material being cut, dimensions and tolerance, machine model and wire speed, target kerf loss, spool length and monthly volume.