Overview
An electroplated diamond cutting wire built on high-strength carbon steel, the workhorse consumable for multi-wire slicing of photovoltaic wafers. DIALINE supplies 26–550 µm, graded by diameter and diamond grit within one coating process.
Specifications
| Parameter | Range / note | Effect on selection |
|---|---|---|
| Wire diameter | 26–550 µm | Smaller diameter cuts kerf loss but demands higher substrate strength and tension control |
| Substrate | High-strength carbon steel | Sets breaking force and breakage rate |
| Coating | Nickel-bonded diamond, electroplated | Sets grit retention, shedding rate and wire life |
| Diamond grit | Graded by workpiece | Coarse grit cuts faster; fine grit gives a cleaner kerf |
Applications
- Multi-wire slicing of mono- and poly-crystalline silicon wafers.
- Slicing and shaping of sapphire, magnetic materials and precious stone.
- Precision cutting of semiconductor and optical materials.
Delivery
Diameter, strength, spool length and packaging are confirmed against the machine and duty; MOQ, sampling and production lead time on inquiry.
| Model | 26–550 µm, multiple grades |
|---|---|
| Material / Process | High-strength carbon steel with electroplated nickel-bonded diamond |
| Certification | National Manufacturing Single Champion; lead drafting unit of the electroplated diamond wire standard |
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