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Changsha DIALINE New Material Sci. & Tech. Co., Ltd.
Diamond wire and advanced materials — Changsha and Zhuzhou, Hunan

Products

Portfolio Overview

The product matrix follows the “4+1” structure: PV cutting materials, consumer-electronics precision processing, hydrogen and energy-storage components, semiconductor and AI precision transmission, plus extended diamond-wire applications in hard and brittle materials. All seven lines share the same electroplated-diamond and ultra-fine tungsten wire capabilities; they differ in substrate, wire diameter and duty.

PV Cutting Materials

Hydrogen and Energy Storage

Graphite composite bipolar plates for fuel cells and flow batteries, developed and manufactured within Gengchi New Energy.

Semiconductors and AI

Ultra-fine tungsten wire and robot tendon rope — in-house wire down to 0.005 mm, the base material for high-end bio-inspired tendon rope.

Other Business Lines

Cover-glass precision processing: delivered by Huizhou DIALINE Precision Manufacturing for phone brands, ODM/OEM manufacturers and smart-device makers — flat and curved cover glass, tablet touch-panel glass and decorative body glass.

Functional new materials and wet electronic chemicals: key materials for integrated circuits and display panels, directly affecting yield and electrical performance.

These two lines are service- and category-based and are not published as separate product pages. For datasheets and capacity information, please send an inquiry.

Product

Carbon-steel Diamond Wire

Electroplated diamond wire on high-strength carbon steel, 26–550 µm, the workhorse consumable for PV multi-wire wafer slicing.

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Product

Loop Diamond Wire

Closed-loop diamond wire for squaring and cropping silicon ingots, cutting semiconductor material and shaping precious stone.

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Product

Tungsten Wire Rope

Multi-strand fine tungsten wire rope for the pulling system of crystal-growing furnaces: strong, low-elongation, heat and fatigue resistant.

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Product

High-purity Quartz Sand

Feedstock for quartz crucibles in the crystalline-silicon chain; trace elements and particle size drive crucible life and wafer yield.

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