Overview
Diamond wire on a high-strength tungsten core, supplied in 24–30 µm. Tungsten carries markedly higher tensile strength than carbon steel at the same diameter, so a finer wire still keeps breakage under control — the enabling consumable for thinner wafers and larger ingots.
Why Tungsten
- Lower kerf loss: a finer wire raises wafers per ingot and reduces silicon loss.
- More strength margin: fewer breaks at the same tension, suited to high-speed multi-wire slicing.
- The barrier is the coating: uniform adhesion, sufficient retention and low coating stress decide whether a fine wire survives at speed.
Key Parameters
| Item | Value |
|---|---|
| Wire diameter | 24–30 µm |
| Substrate | High-strength tungsten wire |
| Coating | Nickel-bonded diamond, electroplated |
| Typical use | PV wafer slicing (thinner wafers, larger ingots) |
Delivery
Diameter, strength, spool length and packaging are confirmed against the machine and duty; MOQ, sampling and production lead time on inquiry.
| Model | 24–30 µm |
|---|---|
| Material / Process | High-strength tungsten wire with electroplated nickel-bonded diamond |
| Certification | National Manufacturing Single Champion |
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