Overview
Weld the diamond wire into a closed loop, run it over guide pulleys at high speed, and you have loop diamond wire. No jointing and no spooling; the kerf is flat and wire speed is high. It is used mainly for feedstock preparation of hard and brittle materials — squaring and cropping silicon ingots, cutting semiconductor material, and cutting precious stone.
Versus Reciprocating Multi-wire Slicing
| Aspect | Loop diamond wire | Reciprocating multi-wire |
|---|---|---|
| Motion | Closed loop, one-directional, high speed | Wire reciprocates between spools |
| Process fit | Squaring, cropping, single-part shaping | Batch wafer slicing |
| Kerf | Flat, no joint discontinuity | Affected by wire bow and tension fluctuation |
Applications
- Squaring and cropping silicon ingots.
- Cutting semiconductor materials.
- Shaping sapphire and precious stone.
Delivery
Diameter, strength, spool length and packaging are confirmed against the machine and duty; MOQ, sampling and production lead time on inquiry.
| Model | Closed loop, circumference made to machine |
|---|---|
| Material / Process | Steel core with electroplated diamond |
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